SINTEF contributed in this project by using its competence in sensor design, signal processing, edge processing and acoustic. Together with the project owner and other vendors, we have participated in constructing and testing the first prototype tool. Parts of the project work include development analogue amplifiers in a wide range of temperature, high speed ADC and DACs, several power supplies, FPGA, and memory. We have leveraged edge computing to process the data close to sensors in down-hole and transmit the processed data to surface via CAN communication.
Photo: Shutterstock (Denys Yelmanov)