Photonic Integrated Circuits
To make photonic sensors as ubiquitous as electronic sensors, several constraints on size, cost and weight must be overcome. In this context, wafer-level silicon photonics is disruptive in offering photonics in a miniature package and at low cost, of which Photonic Integrated Circuits (PIC) is emerging as a particularly promising and versatile platform for light manipulation.
New photonic-enabled sensing functions
Guiding light through waveguide structures on a chip with micron and nanometre features, PIC has the potential to offer new photonic-enabled sensing functions rivalling the performance of larger, heavier, and more expensive photonic systems. In addition to the general importance of sensors towards the twin green and digital transition, intensified efforts specifically directed towards chip-based technologies such as PIC are of significantly importance towards European Technological Sovereignty in relation to the ambitions of the European Chips-Act Initiative.
Research and upscaling of silicon photonics
In response to the recent supply-shocks in semiconductor components caused by the Covid-19 pandemic, the EU commission set the ambitious target of doubling the EU market share in the rapidly growing semiconductor sector, aiming for 20 per cent by 2030. This ambition includes research into and upscaling of silicon photonics and has only grown in importance with the new geopolitical situation following the war in Ukraine and tensions between the west and China.
Demonstrating multi-analyte PIC sensor platform utilizing a chiplet approach
COMPAS seeks to take a significant step towards full co-integration of photonics and microelectronics by demonstrating a first-of-a-kind, wafer-level-integrated multi-analyte PIC sensor platform (PSP) utilizing a chiplet approach.
